HS Laser Float Glass Laser Cutting Macahine with 600X700mm Double Working Table

• Customization: Available
• Certification: CE, FDA, ISO
• Cutting Method: Laser Cutting
• Model NO.: HS-Pi60 / HS-Pi80
• Maximum Cutting Thickness: 20 mm
• Power Supply: 220V
• Safety Features: Emergency Stop Button, Overload Protection, Safety Sensor
• Laser Source: Picosecond and CO2 Laser
• Cut Material: Float Glass, K9 Glass,Mirror Glass,High Borosilica
• Standard Working: 600X700mm Double Work Table
• Cut Maximum Thickness: 0.03-25mm
• Lead Time: 45 Working Days
• Accuracy: ±0.01mm
• Cutting Speed: 0-500mm/S
• Chipping: ≤5μm
• Transport Package: 2600mmx1900mmx2450mm
• Specification: 9000kg
• Trademark: HS LASER
• Origin: Shenzhen
• HS Code: 8515800090
• Production Capacity: 100

Product Description

Product Description

 

HS LASER float glass laser cutting macahine with 600x700mm double working table
 

Picosecond Laser Glass Cutting Machine: Applications, Compatible Glass Types, and Cutting Parameters

 

1. Core Application Industries

1.1 Consumer Electronics

• Target Materials:

  • Smartphone/tablet cover glass (e.g., Corning Gorilla Glass, AGC Dragontrail).

  • Curved glass for wearables (e.g., smartwatches, AR/VR lenses).

• Key Requirements:

  • Ultra-thin glass cutting (0.3-1.1 mm) with anti-cracking technology.

  • High-precision shaped cuts (e.g., camera holes, fingerprint modules) with ±5 μm accuracy.

• Case Study:

  • A global smartphone manufacturer uses a 20W picosecond laser to cut 0.7 mm microcrystalline glass, achieving edge chipping <10 μm.

1.2 Automotive & Autonomous Driving

• Target Materials:

  • Curved glass for automotive triple-screen displays (1.5-3 mm thickness).

  • Quartz optical windows for LiDAR systems.

  • HUD projection glass with anti-glare coatings.

• Technical Edge:

  • 3D dynamic focusing for cutting curved surfaces (radius ≥8 mm).

  • Heat-affected zone (HAZ) <30 μm, critical for optical clarity.

• Case Study:

  • Automotive uses a 30W system to cut LiDAR-grade fused silica lenses (1.2 mm thickness).

1.3 Advanced Display Manufacturing

• Mini/Micro LEDCutting 0.2 mm ultra-thin glass substrates (CTE <3.5×10/K) with 2 μm line accuracy.

• OLED Flexible Screens:

  • Delicate cutting of glass encapsulation layers (50-100 μm) on PI substrates, using pulse energy <10 μJ to prevent delamination.

1.4 Precision Optics

• High-End Applications:

  • Fluorophosphate optical glass (refractive index: 1.45-1.9) cutting for lenses and prisms.

  • 
    
    Infrared chalcogenide glass (e.g., Ge28Sb12Se60) for thermal imaging systems.

• Case Study:

  • UK-based Renishaw utilizes a 25W picosecond laser to cut 80 mm diameter sulfur-basd glass lenses at 300 mm/s.

2. Glass Types & Cutting Parameters Matrix

Glass Type	Key Properties	Recommended Power	Thickness Range	Cutting Speed	Critical Configurations
Soda-Lime Glass (Architectural)	Hardness: 5.5 Mohs, CTE: 9×10/K	30W+	0.5-8 mm	200 mm/s	Nassist to prevent edge carbonization
Borosilicate Glass (Labware)	Thermal resistance: 560°C, CTE: 3.3×10/K	20-30W	0.3-5 mm	150 mm/s	Vacuum chuck to minimize thermal warping
Fused Silica (Optical)	Purity: 99.99%, Melting point: 1750°C	30W+	0.1-10 mm	80 mm/s	532 nm green laser for optimal absorption
Ultra-Thin Electronic Glass	Thickness: 0.05-0.3 mm, Flexural strength: >800 MPa	10-15W	0.05-0.5 mm	500 mm/s	Air-bearing stage to suppress microcracks
Chemically Strengthened Glass	Surface compressive stress: >700 MPa	15-25W	0.3-2 mm	300 mm/s	Burst mode to penetrate stress layers

 

3. Power vs. Threshold Guidelines

• General Rule:

  • Power (W) ≈ 2 × Glass Thickness (mm) + 10 (for standard soda-lime glass).

  • Example: 2 mm glass → ~14W minimum power (add 20-50% buffer for complex shapes).

• Speed Adjustment:

  • For every 0.1 mm thickness increase, reduce speed by 15-20 mm/s (for borosilicate).

 

4. Industry-Specific Technical Highlights

• Medical Devices (US Market Focus):

  • Cutting 1 mm bioactive glass (e.g., 45S5 Bioglass®) for endoscopic tools with zero toxic byproducts.

• Aerospace (UK/Germany Focus):

  • 3 mm aluminosilicate glass cutting for aircraft cabin windows (Ra <0.4 μm post-cutting).

• Renewable Energy (US/Germany):

  • CdTe thin-film solar glass cutting using 20W + fume extraction to prevent Cd release.
    
     

Model number: HS-Pi50 /HS-Pi60 /HS-Pi75 / HS-Pi80 /HS-Pi90	Power supply:Single-phase 220V±10%, 50/60Hz AC
Laser power:50W 60W 75W 80W 90W	Whole machine power consumption:
Laser type: Picosecond laser and RF co2 laser	Working environment humidity:20-26°C
Laser wavelength: 1064±5nm	Control system:HS LASER (customized ) Support English operation system
Working area: Standard 600x700mm double working table	CNC machine bed:Plate sheet welding
Repetition Rate:Single Shot to 8 MHz	Working desk:Marble countertop
Spatial Mode: M^2 < 1.3	Pulse Width Measured at 1064nm: 10 picoseconds
Pointing Stability Over Constant Temperature +/2 °C: < 50 μrad / °C	Machine weight:>5ton
Picosend cutting speed:500mm/s	Laser cutting head:Bessel

Detailed Photos