2025 New Picosecond Laser Glass Cutting Machine with 600X700mm Double Working Table for Cutting Tempered Glass

Product Description

HS LASER float glass laser cutting macahine with 600x700mm double working table
 

Picosecond Laser Glass Cutting Machine: Applications, Compatible Glass Types, and Cutting Parameters

 

1. Core Application Industries

1.1 Consumer Electronics

• Target Materials:

  • Smartphone/tablet cover glass (e.g., Corning Gorilla Glass, AGC Dragontrail).

  • Curved glass for wearables (e.g., smartwatches, AR/VR lenses).

• Key Requirements:

  • Ultra-thin glass cutting (0.3-1.1 mm) with anti-cracking technology.

  • High-precision shaped cuts (e.g., camera holes, fingerprint modules) with ±5 μm accuracy.

• Case Study:

  • A global smartphone manufacturer uses a 20W picosecond laser to cut 0.7 mm microcrystalline glass, achieving edge chipping <10 μm.

1.2 Automotive & Autonomous Driving

• Target Materials:

  • Curved glass for automotive triple-screen displays (1.5-3 mm thickness).

  • Quartz optical windows for LiDAR systems.

  • HUD projection glass with anti-glare coatings.

• Technical Edge:

  • 3D dynamic focusing for cutting curved surfaces (radius ≥8 mm).

  • Heat-affected zone (HAZ) <30 μm, critical for optical clarity.

• Case Study:

  • Automotive uses a 30W system to cut LiDAR-grade fused silica lenses (1.2 mm thickness).

1.3 Advanced Display Manufacturing

• Mini/Micro LEDCutting 0.2 mm ultra-thin glass substrates (CTE <3.5×10/K) with 2 μm line accuracy.

• OLED Flexible Screens:

  • Delicate cutting of glass encapsulation layers (50-100 μm) on PI substrates, using pulse energy <10 μJ to prevent delamination.

1.4 Precision Optics

• High-End Applications:

  • Fluorophosphate optical glass (refractive index: 1.45-1.9) cutting for lenses and prisms.

  • Infrared chalcogenide glass (e.g., Ge28Sb12Se60) for thermal imaging systems.

• Case Study:

  • UK-based Renishaw utilizes a 25W picosecond laser to cut 80 mm diameter sulfur-basd glass lenses at 300 mm/s.

2. Glass Types & Cutting Parameters Matrix

Glass Type	Key Properties	Recommended Power	Thickness Range	Cutting Speed	Critical Configurations
Soda-Lime Glass (Architectural)	Hardness: 5.5 Mohs, CTE: 9×10/K	80W	0.5-8 mm	200 mm/s	Nassist to prevent edge carbonization
Borosilicate Glass (Labware)	Thermal resistance: 560°C, CTE: 3.3×10/K	80W	0.3-5 mm	150 mm/s	Vacuum chuck to minimize thermal warping
Fused Silica (Optical)	Purity: 99.99%, Melting point: 1750°C	80W	0.1-10 mm	80 mm/s	532 nm green laser for optimal absorption
Ultra-Thin Electronic Glass	Thickness: 0.05-0.3 mm, Flexural strength: >800 MPa	80W	0.05-0.5 mm	500 mm/s	Air-bearing stage to suppress microcracks
Chemically Strengthened Glass	Surface compressive stress: >700 MPa	80W	0.3-2 mm	300 mm/s	Burst mode to penetrate stress layers

 

3. Power vs. Threshold Guidelines

• General Rule:

  • Power (W) ≈ 2 × Glass Thickness (mm) + 10 (for standard soda-lime glass).

  • Example: 2 mm glass → ~14W minimum power (add 20-50% buffer for complex shapes).

• Speed Adjustment:

  • For every 0.1 mm thickness increase, reduce speed by 15-20 mm/s (for borosilicate).

 

4. Industry-Specific Technical Highlights

• Medical Devices (US Market Focus):

  • Cutting 1 mm bioactive glass (e.g., 45S5 Bioglass®) for endoscopic tools with zero toxic byproducts.

• Aerospace (UK/Germany Focus):

  • 3 mm aluminosilicate glass cutting for aircraft cabin windows (Ra <0.4 μm post-cutting).

• Renewable Energy (US/Germany):

  • CdTe thin-film solar glass cutting using 20W + fume extraction to prevent Cd release.
    
     

Model number: HS-Pi50 /HS-Pi60 /HS-Pi75 / HS-Pi80 /HS-Pi90	Power supply:Single-phase 220V±10%, 50/60Hz AC
Laser power:50W 60W 75W 80W 90W	Whole machine power consumption:
Laser type: Picosecond laser and RF co2 laser	Working environment humidity:20-26°C
Laser wavelength: 1064±5nm	Control system:HS LASER (customized ) Support English operation system
Working area: Standard 600x700mm double working table	CNC machine bed:Plate sheet welding
Repetition Rate:Single Shot to 8 MHz	Working desk:Marble countertop
Spatial Mode: M^2 < 1.3	Pulse Width Measured at 1064nm: 10 picoseconds
Pointing Stability Over Constant Temperature +/2 °C: < 50 μrad / °C	Machine weight:>5ton
Picosend cutting speed:500mm/s	Laser cutting head:Bessel

Detailed Photos